Book/Report FZJ-2020-00397

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Plasmaabscheidung von mikrokristallinem Silizium: Merkmale und Mikrostruktur und deren Deutung im Sinne von Wachstumsvorgängen



2000
Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag Jülich

Jülich : Forschungszentrum Jülich GmbH Zentralbibliothek, Verlag, Berichte des Forschungszentrums Jülich 3753, 138 p. ()

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Report No.: Juel-3753

Abstract: The microstructure of microcrystalline silicon ($\mu$c-Si:H) grown in a low-temperature ($\lesssim$ 400 °C) PECVD process was investigated in dependence on the process parameters and the choice of the substrate material. For characterization, Raman spectroscopy, X-ray diffraction, atomic force microscopy and transmission electron microscopy were applied. lt is shown that a stationary growth is observed in the long term structural evolution of the thin films. The characteristics of this stationary growth can be described in relation to the crystallinity of the microcrystalline samples, irrespective of the details of plasma processing and the nature of the substrate. This also applies for the initially homoepitaxial growth on Si(100), which transforms to disordered growth under similar structural changes when compared to low-temperature MBE growth. A catalytic role of hydrogen during grain epitaxy is suggested therefore and existing models for the growth of μc-Si:H are extended in order to explain for the formation of {111} facets, planar defects on {111} planes and a preferred crystallographic orientation. The present study evidences limitations for tailoring the structural properties of $\mu$c-Si:H according to technical demands. E.g. the columnar morphology and the formation of structural defects limit the extent of coherent crystalline domains. Their sizes cannot be influenced significantly by the choice of the plasma parameters and the substrate material.


Contributing Institute(s):
  1. Publikationen vor 2000 (PRE-2000 ; Retrocat)
Research Program(s):
  1. 899 - ohne Topic (POF3-899) (POF3-899)

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 Record created 2020-01-21, last modified 2021-01-30